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ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author:

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis

Author:

Publisher: ASM International

Published: 2017-12-01

Total Pages:

ISBN-13: 1627081518

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The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Proceedings

Author:

Publisher:

Published: 2005

Total Pages: 556

ISBN-13:

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Physical Assurance

Author: Navid Asadizanjani

Publisher: Springer Nature

Published: 2021-02-15

Total Pages: 193

ISBN-13: 3030626091

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This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.