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Author:
Publisher:
Published: 2008
Total Pages: 785
ISBN-13: 9780071603157
DOWNLOAD EBOOK →System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.
Author: Rao Tummala
Publisher: McGraw Hill Professional
Published: 2007-07-22
Total Pages: 807
ISBN-13: 0071593322
DOWNLOAD EBOOK →System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Rao Tummala
Publisher: Mcgraw-hill
Published: 2008-04-15
Total Pages: 0
ISBN-13: 9780071459068
DOWNLOAD EBOOK →System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Shichun Qu
Publisher: Springer
Published: 2014-09-10
Total Pages: 336
ISBN-13: 1493915568
DOWNLOAD EBOOK →Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Author: Serge Luryi
Publisher: John Wiley & Sons
Published: 2016-09-12
Total Pages: 384
ISBN-13: 1119069181
DOWNLOAD EBOOK →Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.
Author: Ellis Meng
Publisher: CRC Press
Published: 2011-06-22
Total Pages: 410
ISBN-13: 1420051237
DOWNLOAD EBOOK →Poised to dramatically impact human health, biomedical microsystems (bioMEMS) technologies incorporate various aspects from materials science, biology, chemistry, physics, medicine, and engineering. Reflecting the highly interdisciplinary nature of this area, Biomedical Microsystems covers the fundamentals of miniaturization, biomaterials, microfabrication, and nanotechnology, along with relevant applications. Written by an active researcher who was recently named one of Technology Review’s Young Innovators Under 35, the book begins with an introduction to the benefits of miniaturization. It then introduces materials, fabrication technology, and the necessary components of all bioMEMS. The author also covers fundamental principles and building blocks, including microfluidic concepts, lab-on-a-chip systems, and sensing and detection methods. The final chapters explore several important applications of bioMEMS, such as microdialysis, catheter-based sensors, MEMS implants, neural probes, and tissue engineering. For readers with a limited background in MEMS and bioMEMS, this book provides a practical introduction to the technology used to make these devices, the principles that govern their operation, and examples of their application. It offers a starting point for understanding advanced topics and encourages readers to begin to formulate their own ideas about the design of novel bioMEMS. A solutions manual is available for instructors who want to convert this reference to classroom use.
Author: Lei He
Publisher: Now Publishers Inc
Published: 2011-06-20
Total Pages: 93
ISBN-13: 1601984588
DOWNLOAD EBOOK →Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Author: Jack Cazes
Publisher: CRC Press
Published: 2004-11-30
Total Pages: 1066
ISBN-13: 0849390397
DOWNLOAD EBOOK →Compiled by the editor of Dekker's distinguished Chromatographic Science series, this reader-friendly reference is as a unique and stand-alone guide for anyone requiring clear instruction on the most frequently utilized analytical instrumentation techniques. More than just a catalog of commercially available instruments, the chapters are wri
Author: Hiren D. Patel
Publisher: Springer Science & Business Media
Published: 2008-06-06
Total Pages: 212
ISBN-13: 1402084722
DOWNLOAD EBOOK →ESL or “Electronic System Level” is a buzz word these days, in the electronic design automation (EDA) industry, in design houses, and in the academia. Even though numerous trade magazine articles have been written, quite a few books have been published that have attempted to de?ne ESL, it is still not clear what exactly it entails. However, what seems clear to every one is that the “Register Transfer Level” (RTL) languages are not adequate any more to be the design entry point for today’s and tomorrow’s complex electronic system design. There are multiple reasons for such thoughts. First, the c- tinued progression of the miniaturization of the silicon technology has led to the ability of putting almost a billion transistors on a single chip. Second, applications are becoming more and more complex, and integrated with c- munication, control, ubiquitous and pervasive computing, and hence the need for ever faster, ever more reliable, and more robust electronic systems is pu- ing designers towards a productivity demand that is not sustainable without a fundamental change in the design methodologies. Also, the hardware and software functionalities are getting interchangeable and ability to model and design both in the same manner is gaining importance. Given this context, we assume that any methodology that allows us to model an entire electronic system from a system perspective, rather than just hardware with discrete-event or cycle based semantics is an ESL method- ogy of some kind.
Author: Thomas Laurell
Publisher: Royal Society of Chemistry
Published: 2004
Total Pages: 644
ISBN-13: 9780854048960
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