Substrate Noise Coupling in Mixed-Signal ASICs

Substrate Noise Coupling in Mixed-Signal ASICs PDF

Author: Stéphane Donnay

Publisher: Springer Science & Business Media

Published: 2006-05-31

Total Pages: 311

ISBN-13: 0306481707

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This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs PDF

Author: X. Aragones

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 242

ISBN-13: 1475730136

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Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.

Characterization of Substrate Noise Coupling, Its Impacts and Remedies in RF and Mixed-signal ICs

Characterization of Substrate Noise Coupling, Its Impacts and Remedies in RF and Mixed-signal ICs PDF

Author: Ahmed Helmy

Publisher:

Published: 2006

Total Pages:

ISBN-13:

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Abstract: Substrate noise coupling in integrated circuits is the process by which interference signals generated by high speed digital blocks cause parasitic currents to flow in the silicon substrate and couple devices in various parts of the circuits on this common substrate. In RFIC the switching noise couples to the sensitive analog circuits through the substrate causing degradation in performance and yield hit. Overcoming substrate coupling is a key issue in successful "system on chip" integration. In this thesis a substrate aware design flow is built, calibrated to silicon and used as part of the design flow to uncover substrate coupling problems in RFICs in the design phase. The flow is used to develop the first comprehensive RF substrate noise isolation design guide to be used by RF designers during the design phase. This will allow designers to optimize the design to maximize noise isolation and protect sensitive blocks from being degraded by substrate noise coupling. Several effects of substrate coupling on circuit performance will be identified and remedies will be given based on the design guide. Three case studies are designed to analyze the substrate coupling problem in RFICs. The case studies are designed to attack the problem from the device, circuit and system levels. On the device level a special emphasis is given to designing on chip inductors as an important device in RFIC. An accurate model is developed for a broadband fit of the inductor scattering parameters. This model is shown to be scalable and is proven to be accurate across various frequency bands and geometries. A special emphasis is put on the design for manufacturing effects that affect the design robustness. A circuit level case study is developed and results are compared to simulations and measurements to highlight the need for such a flow before tapping out to ensure a yielding part. The system level problem studied is a GSM receiver where the research results are directly applied to it as a demonstration vehicle to debug and resolve a system level substrate noise coupling problem that otherwise caused a product to be on the edge of malfunction.

Noise Coupling in System-on-Chip

Noise Coupling in System-on-Chip PDF

Author: Thomas Noulis

Publisher: CRC Press

Published: 2018-01-09

Total Pages: 519

ISBN-13: 1138031615

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Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

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