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Substrate Noise

Author: Edoardo Charbon

Publisher: Springer Science & Business Media

Published: 2007-05-08

Total Pages: 178

ISBN-13: 0306481715

In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.

Substrate Noise Coupling in Mixed-Signal ASICs

Author: Stéphane Donnay

Publisher: Springer Science & Business Media

Published: 2006-05-31

Total Pages: 311

ISBN-13: 0306481707

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This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Substrate Integrated Suspended Line Antenna and Arrays

Author: Kaixue Ma

Publisher: Springer Nature

Published: 2023-12-23

Total Pages: 234

ISBN-13: 9819950112

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This book delves deeply into the substrate integrated suspended line antenna technologies and evaluates its potential to replace conventional three-dimensional (3D) metal-based antennas. Over the years, studies on substrate integrated suspended line antennas have captivated engineers and scientists from the antennas and related engineering fields, all aiming to achieve low-cost and low-loss characteristics. The book establishes a fundamental framework for this topic, while emphasizing the importance of substrate integrated suspended line antennas in the wireless communication and radar systems. It is designed for undergraduate and graduate students who are interested in antenna technology, researchers investigating substrate integrated technology, and antenna engineers working on low-cost and low-loss antennas and arrays.

Substrate Integrated Suspended Line Circuits and Systems

Author: Kaixue Ma

Publisher: Artech House

Published: 2024-03-31

Total Pages: 305

ISBN-13: 1685690300

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Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.

Preliminary Investigation of Particle-substrate Bonding of Plasma-sprayed Materials

Author: Salvatore J. Grisaffe

Publisher:

Published: 1963

Total Pages: 38

ISBN-13:

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Parasitic Substrate Coupling in High Voltage Integrated Circuits

Author: Pietro Buccella

Publisher: Springer

Published: 2018-03-14

Total Pages: 183

ISBN-13: 3319743821

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This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.

Substrate Noise Coupling in RFICs

Author: Ahmed Helmy

Publisher: Springer Science & Business Media

Published: 2008-03-23

Total Pages: 129

ISBN-13: 1402081669

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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

Creoles, their Substrates, and Language Typology

Author: Claire Lefebvre

Publisher: John Benjamins Publishing

Published: 2011-02-17

Total Pages: 638

ISBN-13: 9027287430

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Since creole languages draw their properties from both their substrate and superstrate sources, the typological classification of creoles has long been a major issue for creolists, typologists, and linguists in general. Several contradictory proposals have been put forward in the literature. For example, creole languages typologically pair with their superstrate languages (Chaudenson 2003), with their substrate languages (Lefebvre 1998), or even, creole languages are alike (Bickerton 1984) such that they constitute a “definable typological class” (McWhorter 1998). This book contains 25 chapters bearing on detailed comparisons of some 30 creoles and their substrate languages. As the substrate languages of these creoles are typologically different, the detailed investigation of substrate features in the creoles leads to a particular answer to the question of how creoles should be classified typologically. The bulk of the data show that creoles reproduce the typological features of their substrate languages. This argues that creoles cannot be claimed to constitute a definable typological class.

Handbook of Synthetic Substrates

Author: H.C. Hemker

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 182

ISBN-13: 9400966903

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The need for a handbook on the use of synthetic substrates for assay of proteases of the coagulation and fibrinolytic systems became evident several years ago during the activities of the Subcommittee on Synthetic Substrates of the International Committee on Thrombosis and Haemo stasis (lCTH). Production of such a handbook, which was recommended during discussions of the ICTH at its meeting in London in 1979 was made possible by the generous efforts of Professor HC Hemker with the aid of several contributors with particular interests in the use of synthetic substrates in coagulation and fibrinolysis. As current Chairman and Secretary General of the ICTH we would like to express our sincere thanks to Professor Hemker for producing this handbook and look for ward to seeing the benefits of this tremendous effort reflected in the advancement of our understanding of thrombosis and hemostasis and the transfer of such knowledge into improved diagnosis and treatment of thrombotic and hemorrhagic disorders. Craig M Jackson Professor of Biological Chemistry Washington University School of Medicine, St. Louis, MO Chairman, ICTH Harold R Roberts Professor of Internal Medicine University of North Carolina, Chapel Hill, NC Secretary General, ICTH ix Foreword The advent of synthetic substrates for the study of blood coagulation and fibrinolysis was a significant step forward in the investigation of these systems. Both basic research and clinical laboratory investigations can profit from these advanced tools.

Substrate Surface Preparation Handbook

Author: Max Robertson

Publisher: Artech House

Published: 2011

Total Pages: 197

ISBN-13: 1608072142

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Substrate Surface Preparation serves as a practical, one-stop reference, covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers you detailed guidance in the entire substrate surface preparation process, from lapping and polishing... to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides you with a complete understanding of important maintenance methods and the full range of equipment available in the field. You gain the know-how and confidence you need to produce desired results when processing a sample of new material, rather than wasting time and money on a trial and error approach. Moreover, this authoritative book presents in-depth discussions on key applications, such as optics production and semiconduictor de-lamination and deconstruction.