Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. Hunt
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 498
ISBN-13: 9781566772587
DOWNLOAD EBOOK →Author: Charles E. Hunt
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 498
ISBN-13: 9781566772587
DOWNLOAD EBOOK →Author: Charles E. Hunt
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 496
ISBN-13: 9781566772587
DOWNLOAD EBOOK →Author: International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Publisher:
Published: 1993-12
Total Pages: 485
ISBN-13: 9781566770682
DOWNLOAD EBOOK →Author: C. Colinge
Publisher: The Electrochemical Society
Published: 2010-10
Total Pages: 656
ISBN-13: 1566778239
DOWNLOAD EBOOK →Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author:
Publisher: The Electrochemical Society
Published: 2003
Total Pages: 408
ISBN-13: 9781566774024
DOWNLOAD EBOOK →Author:
Publisher: The Electrochemical Society
Published: 2008-10
Total Pages: 588
ISBN-13: 1566776546
DOWNLOAD EBOOK →This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author:
Publisher: The Electrochemical Society
Published: 2005
Total Pages: 476
ISBN-13: 9781566774604
DOWNLOAD EBOOK →Author: H. Baumgart
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 310
ISBN-13: 9781566773607
DOWNLOAD EBOOK →Author: Helmut Baumgart
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 398
ISBN-13: 156677506X
DOWNLOAD EBOOK →This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author: U. Gösele
Publisher: The Electrochemical Society
Published: 1998
Total Pages: 636
ISBN-13: 9781566771894
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