Semiconductor Silicon 2002
Author: Howard R. Huff
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 650
ISBN-13: 9781566773744
DOWNLOAD EBOOK →Author: Howard R. Huff
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 650
ISBN-13: 9781566773744
DOWNLOAD EBOOK →Author: Howard R. Huff
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 650
ISBN-13: 9781566773744
DOWNLOAD EBOOK →Author: Electrochemical Society. Electronics Division
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 506
ISBN-13: 9781566773287
DOWNLOAD EBOOK →Author: Howard R. Huff
Publisher: The Electrochemical Society
Published: 1994
Total Pages: 1284
ISBN-13: 9781566770422
DOWNLOAD EBOOK →Author: Volker Lehmann
Publisher: Wiley-VCH
Published: 2002-04-22
Total Pages: 300
ISBN-13:
DOWNLOAD EBOOK →Silicon has been and will most probably continue to be the dominant material in semiconductor technology. Although the defect-free silicon single crystal is one of the best understood systems in materails science, its electrochemistry to many people is still a kind of "alchemy". This view is partly due to the interdisciplinary aspects of the topic: Physics meets chemistry at the silicon-electrolyte interface. This book gives a comprehensive overview of this important aspect of silicon technology as well as examples of applications ranging from photonic crystals to biochips. It will serve materials scientists as well as engineers involved in silicon technology as a quick reference with its more than 150 technical tables and diagrams and ca. 1000 references cited for easy access of the original literature.
Author: Yoshio Nishi
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 3276
ISBN-13: 1351829823
DOWNLOAD EBOOK →Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Gerhard Wachutka
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 387
ISBN-13: 3709106249
DOWNLOAD EBOOK →This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.