Author: Institute for Applied Technology (U.S.). Electronic Technology Division
Publisher:
Published: 1974
Total Pages: 70
ISBN-13:
DOWNLOAD EBOOK →Author: A. Christou
Publisher: RIAC
Published: 2006
Total Pages: 410
ISBN-13: 1933904151
DOWNLOAD EBOOK →Author: John Lau
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 904
ISBN-13: 1468477676
DOWNLOAD EBOOK →Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author: National Institute of Standards and Technology (U.S.)
Publisher:
Published: 1990
Total Pages: 140
ISBN-13:
DOWNLOAD EBOOK →Author: United States. National Bureau of Standards
Publisher:
Published: 1988
Total Pages: 116
ISBN-13:
DOWNLOAD EBOOK →Author: Michael Pecht
Publisher: CRC Press
Published: 2018-10-24
Total Pages: 844
ISBN-13: 1351829971
DOWNLOAD EBOOK →Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author: Hal Greenhouse
Publisher: William Andrew
Published: 2011-10-28
Total Pages: 365
ISBN-13: 1437778771
DOWNLOAD EBOOK →Hermeticity of Electronic Packages is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journalsùor only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.