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Recent Progress in Lead-Free Solder Technology

Author: Mohd Arif Anuar Mohd Salleh

Publisher: Springer Nature

Published: 2022-03-01

Total Pages: 332

ISBN-13: 3030934411

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Recent Progress inSoldering Materials

Author: Ahmad Azmin Mohamad

Publisher: BoD – Books on Demand

Published: 2017-11-29

Total Pages: 120

ISBN-13: 9535136437

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This book is about solders and their composition and focuses on material characterizations and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties and the factors that control them and theoretical verification are the main contents of this book. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.

A Guide to Lead-free Solders

Author: John W. Evans

Publisher: Springer Science & Business Media

Published: 2007-01-05

Total Pages: 212

ISBN-13: 1846283108

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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Lead-free Solders

Author: K. Subramanian

Publisher: John Wiley & Sons

Published: 2012-03-06

Total Pages: 510

ISBN-13: 1119966809

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Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Lead-Free Electronic Solders

Author: KV Subramanian

Publisher: Springer Science & Business Media

Published: 2007-06-28

Total Pages: 370

ISBN-13: 0387484337

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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Lead-Free Soldering

Author: Jasbir Bath

Publisher: Springer Science & Business Media

Published: 2007-06-26

Total Pages: 307

ISBN-13: 0387684220

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The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Fundamentals of Lead-Free Solder Interconnect Technology

Author: Tae-Kyu Lee

Publisher: Springer

Published: 2014-11-05

Total Pages: 266

ISBN-13: 1461492661

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Author: Mohd Arif Anuar Mohd Salleh

Publisher: Springer Nature

Published: 2023-07-02

Total Pages: 873

ISBN-13: 9811992673

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This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

Solder Joint Technology

Author: King-Ning Tu

Publisher: Springer Science & Business Media

Published: 2007-07-27

Total Pages: 376

ISBN-13: 0387388923

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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Lead-free Solder Implementation

Author: Metallurgical Society. United States

Publisher:

Published: 2006

Total Pages: 113

ISBN-13:

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