Proceedings of the Third International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
Author: Jerzy Rużyłło
Publisher:
Published: 1994
Total Pages: 604
ISBN-13: 9781566770385
DOWNLOAD EBOOK →Author: Jerzy Rużyłło
Publisher:
Published: 1994
Total Pages: 604
ISBN-13: 9781566770385
DOWNLOAD EBOOK →Author: Richard E. Novak
Publisher: The Electrochemical Society
Published: 1996
Total Pages: 642
ISBN-13: 9781566771153
DOWNLOAD EBOOK →Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
Published: 1998
Total Pages: 668
ISBN-13: 9781566771887
DOWNLOAD EBOOK →Author:
Publisher: The Electrochemical Society
Published: 2000
Total Pages: 636
ISBN-13: 9781566772594
DOWNLOAD EBOOK →Author: International Symposium on Cleaning Technology in Cleaning Technology in Semiconductor Devices
Publisher:
Published: 1994
Total Pages: 618
ISBN-13: 9780608017884
DOWNLOAD EBOOK →Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 452
ISBN-13: 9781566774116
DOWNLOAD EBOOK →Author: Takao Abe
Publisher: The Electrochemical Society
Published: 1999
Total Pages: 548
ISBN-13: 9781566772235
DOWNLOAD EBOOK →Author: Karen Reinhardt
Publisher: William Andrew
Published: 2018-03-16
Total Pages: 760
ISBN-13: 032351085X
DOWNLOAD EBOOK →Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process