Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher:
Published: 1999
Total Pages: 290
ISBN-13:
DOWNLOAD EBOOK →Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher:
Published: 1999
Total Pages: 290
ISBN-13:
DOWNLOAD EBOOK →Author: Panayotis C. Andricacos
Publisher: The Electrochemical Society
Published: 1999
Total Pages: 418
ISBN-13: 9781566772310
DOWNLOAD EBOOK →Author: Panayotis C. Andricacos
Publisher: The Electrochemical Society
Published: 2002
Total Pages: 262
ISBN-13: 9781566772730
DOWNLOAD EBOOK →"Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Author: Kazuo Kondo
Publisher: The Electrochemical Society
Published: 2005
Total Pages: 422
ISBN-13:
DOWNLOAD EBOOK →Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
Published: 2003
Total Pages: 620
ISBN-13: 9781566773768
DOWNLOAD EBOOK →Author: Cor L. Claeys
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 636
ISBN-13: 9781566773089
DOWNLOAD EBOOK →Author: G. S. Mathad
Publisher: The Electrochemical Society
Published: 2000
Total Pages: 358
ISBN-13: 9781566772549
DOWNLOAD EBOOK →Author: John O. Dukovic
Publisher: The Electrochemical Society
Published: 2007-09
Total Pages: 288
ISBN-13: 1566775868
DOWNLOAD EBOOK →The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Author: Milan Paunovic
Publisher: The Electrochemical Society
Published: 1998
Total Pages: 666
ISBN-13: 9781566771801
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