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Plasma Processes for Semiconductor Fabrication

Author: W. N. G. Hitchon

Publisher: Cambridge University Press

Published: 1999-01-28

Total Pages: 232

ISBN-13: 9780521591751

Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry.

Particle Contamination Control in Plasma Processing

Author:

Publisher:

Published: 1995

Total Pages: 9

ISBN-13:

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Plasma processing is used for (approximately)35% of the process steps required for semiconductor manufacturing. Recent studies have shown that plasma processes create the greatest amount of contaminant dust of all the manufacturing steps required for device fabrication. Often, the level of dust in a plasma process tool exceeds the cleanroom by several orders of magnitude. Particulate contamination generated in a plasma tool can result in reliability problems as well as device failure. Inter-level wiring shorts different levels of metallization on a device is a common result of plasma particulate contamination. We have conducted a thorough study of the physics and chemistry involved in particulate formation and transport in plasma tools. In-situ laser light scattering (LLS) is used for real-time detection of the contaminant dust. The results of this work are highly surprising: all plasmas create dust; the dust can be formed by homogeneous as well as heterogeneous chemistry; this dust is charged and suspended in the plasma; additionally, it is transported to favored regions of the plasma, such as those regions immediately above wafers. Fortunately, this work has also led to a novel means of controlling and eliminating these unwanted contaminants: electrostatic {open_quotes}drainpipes{close_quotes} engineered into the electrode by means of specially designed grooves. These channel the suspended particles out of the plasma and into the pump port before they can fall onto the wafer.

Plasma Processing of Semiconductors

Author: P.F. Williams

Publisher: Springer Science & Business Media

Published: 2013-11-11

Total Pages: 610

ISBN-13: 9401158843

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Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.

Plasma Processing of Materials

Author: National Research Council

Publisher: National Academies Press

Published: 1991-02-01

Total Pages: 88

ISBN-13: 0309045975

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Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.

Intelligent Electronics Manufacturing: Modeling and Control of Plasma Processing

Author:

Publisher:

Published: 2003

Total Pages: 0

ISBN-13:

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The MURI Center on Modeling and Control of Plasma Processing at the University of Michigan started in September, 1995, and concluded technical work at the end of August 2001. As the name indicates, the major research goals of the center are in the areas of modeling and control of plasma deposition and etching processing. These plasma processes are used extensively in the manufacture of integrated circuits as well as active matrix liquid crystal displays. These applications areas motivate our selection of research problems in modeling and control. Significant accomplishments were made in all of these areas (as will be discussed in the body of the report) Particular program highlights include: (1) An optical technique was developed to monitor in situ and in real time the critical dimensions and wall-shapes of evolving features in reactive ion etchers. An advanced signal processing scheme was devised to use this technique to perform the first fully-automated etch-to-target-dimension etches. One-nanometer-level (or better) accuracy was demonstrated enabling possibilities for extremely high accuracy semiconductor fabrication control. (2) The state-of-the-art of 1st principles plasma equipment modeling was advanced so that the entire system of the sensors, plasma process equipment, and control systems could be modeled numerically. (3) Novel RF Sensing to non-invasively measure the electrical state of plasma systems was developed and applications to detecting common faults were demonstrated. (4) Improved statistical methods for detecting and identifying the causes of spatially clustered defects in semiconductor manufacturing. (5) Development of a novel ion-beam modification process for the deposition of Al films which are more resistant to grain-growth.

Applications of Plasma Processes to VLSI Technology

Author: Takuo Sugano

Publisher: Wiley-Interscience

Published: 1985-09-24

Total Pages: 426

ISBN-13:

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Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.

Plasma Etching Processes for Sub-quarter Micron Devices

Author: G. S. Mathad

Publisher: The Electrochemical Society

Published: 2000

Total Pages: 396

ISBN-13: 9781566772532

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Semiconductor IC Plasma Dry Etching Process

Author: Kung Linliu

Publisher: Independently Published

Published: 2020-02-11

Total Pages: 57

ISBN-13:

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Semiconductor market value of 2018 was around 468.8 billion US dollars. It is increased for about 13.7% than year 2017. For 2019, it is estimated decrease about 10% to 13% which is 422 to 408 billion US dollars.This market is in a way winner takes all, for example, TSMC (Taiwan Semiconductor Manufacturing Company) which is the world leading semiconductor foundry company has more than 50% market share. Intel has more than 90% market share of personal computer CPU (Central Process Unit) for many years. However, the semiconductor IC process technology sometimes might change the rule of market. Just recently, AMD (Advanced Micro Devices, Inc.) has more than 17% market share of personal computer CPU because they use foundry of TSMC with 7nm EUV technology node (Extreme Ultraviolet, its wavelength is 13.5 nm, shorter wavelength has better critical dimension (CD) resolution for IC process).For the present time, there are four leading semiconductor companies in the world with EUV technology process node which are as follows: (1)Samsung: the world leading semiconductor IC process company for commodity IC such as DRAM、Flash memory and IC for cell phone. The world leading company in cell phone market share, Samsung has highest volume unit of mobile phone which is 75.1 million unit representing 23% of world market share. Samsung also is the leading company in OLED (organic light emitting diode) process technology and display panel which is more than 90% of world market share.(2)Intel: is the world leading company in personal computer CPU which has more than 90% market share of personal computer CPU (Central Process Unit) for many years. Intel is actually a world leading semiconductor IC technology in DRAM (many years ago) and Flash (at the present time) memory.(3)TSMC: TSMC is brief of Taiwan Semiconductor Manufacturing Company which is the world leading semiconductor foundry company has more than 50% market share. The author worked there for a few years as an R & D manager many years ago.(4)Micron: a world leading in DRAM and Flash memory IC.

Handbook of Advanced Plasma Processing Techniques

Author: R.J. Shul

Publisher: Springer Science & Business Media

Published: 2011-06-28

Total Pages: 664

ISBN-13: 3642569897

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Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.

Low Pressure Plasmas and Microstructuring Technology

Author: Gerhard Franz

Publisher: Springer Science & Business Media

Published: 2009-04-09

Total Pages: 743

ISBN-13: 3540858490

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Over the last forty years, plasma supported processes have attracted ever - creasing interest, and now, all modern semiconductor devices undergo at least one plasma-involved processing step, starting from surface cleaning via coating to etching. In total, the range of the treated substrates covers some orders of magnitude: Trenches and linewidths of commercially available devices have - ready passed the boundary of 100 nm, decorative surface treatment will happen 2 in the mm range, and the upper limit is reached with surface protecting layers of windows which are coated with ?/4 layers against IR radiation. The rapid development of the semiconductor industry is inconceivable wi- outthegiantprogressintheplasmatechnology.Moore’slawisnotcarvedinto 1 stone, and not only the ITRS map is subject to change every ?ve years but also new branches develop and others mingle together. Moreover, the quality of conventional materials can be improved by plasma treatment:Cottonbecomesmorecrease-resistant,leathermoredurable,andthe shrinking of wool ?bers during the washing process can be signi?cantly reduced. To cut a long story short: More than 150 years after the discovery of the sputtering e?ect by Grove, plasma-based processes are about to spread out into new ?elds of research and application [1]—no wonder that the market for etching machines kept growing by an annual rate of 17 % up to the burst of the internet bubble, and it took only some years of recovery to continue the voyage [2].