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Moisture Sensitivity of Plastic Packages of IC Devices

Author: X.J. Fan

Publisher: Springer Science & Business Media

Published: 2010-07-23

Total Pages: 573

ISBN-13: 1441957197

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Moisture Sensitivity of Plastic Packages of IC Devices

Author: Xuejun Fan

Publisher: Springer

Published: 2011-11-14

Total Pages: 558

ISBN-13: 9781441957207

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3D Microelectronic Packaging

Author: Yan Li

Publisher: Springer

Published: 2017-01-20

Total Pages: 463

ISBN-13: 3319445863

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Electronic Enclosures, Housings and Packages

Author: Frank Suli

Publisher: Woodhead Publishing

Published: 2018-11-15

Total Pages: 490

ISBN-13: 008102391X

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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Advanced Thermal Stress Analysis of Smart Materials and Structures

Author: Zengtao Chen

Publisher: Springer Nature

Published: 2019-09-03

Total Pages: 304

ISBN-13: 3030252019

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This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.

Power Electronic Packaging

Author: Yong Liu

Publisher: Springer Science & Business Media

Published: 2012-02-15

Total Pages: 606

ISBN-13: 1461410533

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Micro and Nanophased Polymeric Composites

Author: Bankim Chandra Ray

Publisher: Woodhead Publishing

Published: 2024-06-15

Total Pages: 252

ISBN-13: 012818955X

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Micro and Nanophased Polymeric Composites: Durability Assessment in Engineering Applications provides a comprehensive review of in-service environmental damage and degradation studies of FRP composites in a broad range of different applications. End-users such as academic and industrial researchers and materials scientists and engineers working in the design, analysis, and manufacture of composite material systems will be able to identify the possible superior advantages and limitations of FRP composites in various applications. Particular emphasis is given on the identification of various failure micro-mechanisms leading to unprecedented failure in different harsh and hostile environments. Divided into two distinct parts, the first section focuses on fundamentals, with key chapters on the main constituents of FRP composites, mechanical properties, characterization techniques, and processing and fabrication techniques. Part two focuses on polymer composites under different in-service applications, including the marine and space environment, chemical and corrosive environments, high and low temperature environments, and other critical environments. Covers various micro-mechanisms of failure under different environmental conditions, including moisture diffusion kinetics and the effects of aging parameters on microstructures Discusses the impact of different nanoscale reinforcements on the environmental durability of conventional FRP composites Presents a comprehensive approach with widespread applications such as low earth orbit space environments and different corrosive environments

Fibrous Polymeric Composites

Author: Bankim Chandra Ray

Publisher: CRC Press

Published: 2018-05-20

Total Pages: 208

ISBN-13: 0429013957

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This book emphasizes the scientific origin of deformation and damage of FRP composites under various environmental effects and analyses present understanding on degradation mechanisms, role of interfaces and addition of nanofillers Discusses micro-characterization of composites and interfaces, also includes micro-mechanisms and microscopic evidences to establish the structure-property correlation Elucidates advantages and limitations of FRP composites in supercritical applications

Organic Photovoltaics

Author: Christoph Brabec

Publisher: John Wiley & Sons

Published: 2014-02-20

Total Pages: 766

ISBN-13: 3527656936

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The versatility of organic photovoltaics is already well known and this completely revised, updated, and enlarged edition of a classic provides an up-to-date overview of this hot topic. The proven structure of the successful first edition, divided into the three key aspects of successful device design: materials, device physics, and manufacturing technologies, has been retained. Important aspects such as printing technologies, substrates, and electrode systems are covered. The result is a balanced, comprehensive text on the fundamentals as well as the latest results in the area that will set R&D trends for years to come. With its combination of both academic and commercial technological views, this is an optimal source of information for scientists, engineers, and graduate students already actively working in this field, and looking for comprehensive summaries on specific topics.

Humidity and Electronics

Author: Rajan Ambat

Publisher: Woodhead Publishing

Published: 2021-11-30

Total Pages: 399

ISBN-13: 0323908543

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Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. Provides basic and applied knowledge surrounding corrosion in electronics Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level