Microelectronics Failure Analysis
Author: Tejinder Gandhi
Publisher:
Published: 2019
Total Pages: 705
ISBN-13: 9781627082457
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Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
Published: 2019-11-01
Total Pages: 750
ISBN-13: 1627082468
DOWNLOAD EBOOK →The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Microelectronic Failure Analysis
Author:
Publisher: ASM International
Published: 2002-01-01
Total Pages: 160
ISBN-13: 0871707691
DOWNLOAD EBOOK →Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Microelectronic Failure Analysis
Author: Richard J. Ross
Publisher: ASM International(OH)
Published: 1999
Total Pages: 664
ISBN-13:
DOWNLOAD EBOOK →Forty-seven papers on electronics failure analysis provide an overview for newcomers to the field and a reference tool for the experienced analyst. Topics include electron/ion bean-based techniques, deprocessing and sample preparation, and physical/chemical defect characterization. For the fourth ed
Microelectronic Failure Analysis Desk Reference
Author:
Publisher: ASM International
Published: 2001-01-01
Total Pages: 162
ISBN-13: 0871707454
DOWNLOAD EBOOK →Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Microelectronic Failure Analysis
Author: Thomas W. Lee
Publisher: Asm International
Published: 1993
Total Pages: 404
ISBN-13: 9780871704795
DOWNLOAD EBOOK →A compact compendium of information and techniques designed to address many of the varied subjects of concern to failure analysis. The volume is divided into sections devoted to failure analysis procedures and overview, electrical and mechanical characterization, specimen preparation, metallurgical
Microelectronics Failure Analysis
Author: EDFAS Desk Reference Committee
Publisher: ASM International
Published: 2011
Total Pages: 673
ISBN-13: 1615037268
DOWNLOAD EBOOK →Includes bibliographical references and index.
Reliability of Organic Compounds in Microelectronics and Optoelectronics
Author: Willem Dirk van Driel
Publisher: Springer Nature
Published: 2022-01-31
Total Pages: 552
ISBN-13: 3030815765
DOWNLOAD EBOOK →This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Systems Failure Analysis
Author: Joseph Berk
Publisher: ASM International
Published: 2009-01-01
Total Pages: 209
ISBN-13: 1615031375
DOWNLOAD EBOOK →3D Microelectronic Packaging
Author: Yan Li
Publisher: Springer Nature
Published: 2020-11-23
Total Pages: 629
ISBN-13: 9811570906
DOWNLOAD EBOOK →This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
