Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection PDF

Author: National Aeronautics and Space Administration (NASA)

Publisher: Createspace Independent Publishing Platform

Published: 2018-07-18

Total Pages: 142

ISBN-13: 9781723202131

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Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. Unspecified Center COMPATIBILITY; ELECTRONIC PACKAGING; SEMICONDUCTORS (MATERIALS); INDUSTRIES; LEADERSHIP; MARKETING...

Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection PDF

Author: NATIONAL MATERIALS ADVISORY BOARD (NAS-NAE) WASHINGTON DC.

Publisher:

Published: 1990

Total Pages: 154

ISBN-13:

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Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. (rh).

Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties PDF

Author: Michael Pecht

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 120

ISBN-13: 1498730868

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Materials for Electronic Packaging

Materials for Electronic Packaging PDF

Author: Deborah D.L. Chung

Publisher: Elsevier

Published: 1995-03-31

Total Pages: 383

ISBN-13: 0080511171

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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Electronic Packaging

Electronic Packaging PDF

Author: John H. Lau

Publisher: McGraw-Hill Professional Publishing

Published: 1998

Total Pages: 0

ISBN-13: 9780070371354

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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging PDF

Author: Xingcun Colin Tong

Publisher: Springer Science & Business Media

Published: 2011-01-05

Total Pages: 633

ISBN-13: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Electronic Packaging and Interconnection Handbook

Electronic Packaging and Interconnection Handbook PDF

Author: Charles A. Harper

Publisher: McGraw-Hill Professional Publishing

Published: 2000

Total Pages: 1112

ISBN-13:

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Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.

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