Mastering Surface Mount Technology
Author: Vincent Himpe
Publisher:
Published: 2012
Total Pages: 282
ISBN-13: 9781907920127
DOWNLOAD EBOOK →Author: Vincent Himpe
Publisher:
Published: 2012
Total Pages: 282
ISBN-13: 9781907920127
DOWNLOAD EBOOK →Author: Ray Prasad
Publisher: Springer Science & Business Media
Published: 2013-11-27
Total Pages: 791
ISBN-13: 1461540844
DOWNLOAD EBOOK →A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Author: Carmen Capillo
Publisher: McGraw-Hill Companies
Published: 1989
Total Pages: 376
ISBN-13:
DOWNLOAD EBOOK →Author: Rudolf Strauss
Publisher: Butterworth-Heinemann
Published: 1994
Total Pages: 392
ISBN-13:
DOWNLOAD EBOOK →Surface mount technology has had a profound influence on the electronics industry. Changes have involved the use of new materials, techniques and manufacturing processes, and have resulted in a significantly new approach to electronics assembly. This book looks at surface mount technology.
Author: Charles M. Savage
Publisher: Butterworth-Heinemann
Published: 1996
Total Pages: 374
ISBN-13: 9780750697019
DOWNLOAD EBOOK →This revised edition of Fifth Generation Management helps executives out of the rigid mindsets of the Industrial Era into the vibrant and invigorating possibilities of co-creation in the Knowledge Era. Divided into two parts, the first completely rewritten section narrates 'Five Days that Changed the Enterprise', a case study of senior executives who are forced out of their cozy little empires into a new network organization of their own design. The second part discusses the process of co-creating through virtual enterprising, dynamic teaming, and knowledge networking. Included is essential new information on fractal enterprises, holonic management systems, agile enterprises, and hypertext organizations. Charles Savage is president of Knowledge Era Enterprises, Inc and was formerly in the consultant division of DIgital Equipment Corporation. He presents 'Master Classes' on dynamic teaming and virtual enterprising and has written extensively on the knowledge era. His company's logo is a key with the phrase "Unlocking the Future". Charles Savage assists companies around the world to achieve that goal. Over 40,000 copies of previous edition sold world-wide Previous edition was awarded 'Book of the Year' by Tom Peters. Covers lessons learned over the last five years since Fifth Generation Management was first published.
Author: Phil Zarrow
Publisher: Newnes
Published: 1997-08-21
Total Pages: 145
ISBN-13: 0750698756
DOWNLOAD EBOOK →Surface Mount Technology Terms and Concepts is an invaluable resource for anyone involved in SMT. This book clearly defines more than 1000 of the most commonly used terms and concepts. By far the most comprehensive glossary of its kind, as well as more accessible and readable than most technical books devoted to assembly, Surface Mount Technology Terms and Concepts contains all of the terms that engineers and managers engaged in surface mount process, manufacturing, quality, design, and purchasing may encounter.
Author: John H. Lau
Publisher: Springer
Published: 1994
Total Pages: 732
ISBN-13:
DOWNLOAD EBOOK →Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Author: Ian Smillie
Publisher: Routledge
Published: 2019-04-02
Total Pages: 244
ISBN-13: 0429719612
DOWNLOAD EBOOK →'Mastering the Machine Revisited' is about the connection between poverty, aid and technology. It is about a search that has been going on, officially in the developing world for over forty years, and less officially in most countries since the beginning of time. It is a search driven today by more hard core poverty than has ever been known, and by
Author: Phil Marcoux
Publisher: Springer Science & Business Media
Published: 2013-11-27
Total Pages: 351
ISBN-13: 1461535328
DOWNLOAD EBOOK →Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.