Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 332
ISBN-13: 9781566774123
DOWNLOAD EBOOK →Lanterna Rally
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Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
Published: 2006-05-28
Total Pages: 252
ISBN-13: 0387233148
DOWNLOAD EBOOK →The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Low Temperature Co-fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
Author: Devin Alexander Smarra
Publisher:
Published: 2017
Total Pages: 74
ISBN-13:
DOWNLOAD EBOOK →Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55°C to 225°C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices.
Low Temperature Electronics
Author: Edmundo A. Gutierrez-D.
Publisher: Academic Press
Published: 2001
Total Pages: 985
ISBN-13: 0123106753
DOWNLOAD EBOOK →Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Low-temperature Electronics
Ceramic Interconnect Technology Handbook
Author: Fred D. Barlow, III
Publisher: CRC Press
Published: 2018-10-03
Total Pages: 373
ISBN-13: 1351837176
DOWNLOAD EBOOK →Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
Author: Bhutani, Akanksha
Publisher: KIT Scientific Publishing
Published: 2019-10-17
Total Pages: 254
ISBN-13: 3731509458
DOWNLOAD EBOOK →Advances in Dielectric Materials and Electronic Devices
Author: K. M. Nair
Publisher: John Wiley & Sons
Published: 2012-04-11
Total Pages: 323
ISBN-13: 1118408179
DOWNLOAD EBOOK →This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Integrated Power Electronics Using a Ferrite-based Low-temperature Co-fired Ceramic Materials System
Ceramic Interconnect Technology Handbook
Author: Fred D. Barlow, III
Publisher: CRC Press
Published: 2018-10-03
Total Pages: 456
ISBN-13: 1420018965
DOWNLOAD EBOOK →Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
