Electrothermal Analysis of VLSI Systems

Electrothermal Analysis of VLSI Systems PDF

Author: Yi-Kan Cheng

Publisher: Springer Science & Business Media

Published: 2005-12-01

Total Pages: 220

ISBN-13: 0306470241

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This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Thermal and Electro-thermal System Simulation 2020

Thermal and Electro-thermal System Simulation 2020 PDF

Author: Márta Rencz

Publisher: MDPI

Published: 2021-01-12

Total Pages: 310

ISBN-13: 303943831X

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Thermal Testing of Integrated Circuits

Thermal Testing of Integrated Circuits PDF

Author: J. Altet

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 212

ISBN-13: 1475736355

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Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution

Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution PDF

Author: Blaise Ravelo

Publisher: Springer Nature

Published: 2019-11-21

Total Pages: 233

ISBN-13: 9811505527

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This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

Principles of Thermal Analysis and Calorimetry

Principles of Thermal Analysis and Calorimetry PDF

Author: Peter Haines

Publisher: Royal Society of Chemistry

Published: 2007-10-31

Total Pages: 234

ISBN-13: 1847551769

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The use of thermal and calorimetric methods has shown rapid growth over the last two decades, in an increasingly wide range of applications. In addition, a number of powerful new techniques have been developed. This book supplies a concise and readable account of the principles, experimental apparatus and practical procedures used in thermal analysis and calorimetric methods of analysis. Brief accounts of the basic theory are reinforced with detailed applications of the methods and contemporary developments. Also included is information on standard test methods and manufacturers. Written by acknowledged experts, Principles of Thermal Analysis and Calorimetry is up-to-date, wide-ranging and practical. It will be an important source of information for many levels of readership in a variety of areas, from students and lecturers through to industrial and laboratory staff and consultants.

Reliability Prediction from Burn-In Data Fit to Reliability Models

Reliability Prediction from Burn-In Data Fit to Reliability Models PDF

Author: Joseph Bernstein

Publisher: Academic Press

Published: 2014-03-06

Total Pages: 108

ISBN-13: 0128008199

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This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. The ability to include reliability calculations and test results in their product design The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions Have accurate failure rate calculations for calculating warrantee period replacement costs