Eighth Electronic Materials and Processing
Author: Srinivas T. Rao
Publisher: ASM International(OH)
Published: 1994
Total Pages: 256
ISBN-13:
DOWNLOAD EBOOK →Author: Srinivas T. Rao
Publisher: ASM International(OH)
Published: 1994
Total Pages: 256
ISBN-13:
DOWNLOAD EBOOK →Author: Charles A. Harper
Publisher: McGraw Hill Professional
Published: 2003-08-07
Total Pages: 768
ISBN-13: 9780071402149
DOWNLOAD EBOOK →Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
Author: M. Neuberger
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 73
ISBN-13: 1468479172
DOWNLOAD EBOOK →This report was prepared by Hughes Aircraft Company, Culver City, California under Contract Number F33615-70-C-1348. The work was administered under the direc tion of the Air Force Materials Laboratory, Air Force Systems Command, Wright Patterson Air Force Base, Ohio, with Mr. B. Emrich, Project Engineer. The Electronic Properties Information Center (EPIC) is adesignated Information Analysis Center of the Department of Defense, authorized to provide information to the entire DoD community. The purpose of the Center is to provide a highly competent source of information and data on the electronic, optical and magnetic properties of materials of value to the Department of Defense. Its major function is to evaluate, compile and publish the experimental data from the world's unclassified literature concerned with the properties of materials. All materials relevant to the field of electronics are within the scope of EPIC: insulators, semiconductors, metals, super conductors, ferrites, ferroelectrics, ferromagnetics, electroluminescents, thermionic emitters and optical materials. The Center's scope includes information on over 100 basic properties of materials; information gene rally regarded as being in the area of devices and/or circuitry is excluded. Grateful acknowledgement is made for the review and comments by Dr. Victor Rehn of the U. S. Naval Ordnance Test Station at China Lake, California, as weIl as for review by staff members of the National Bureau of Standards, National Standard Data Reference System. v CONTENTS Introduction . •. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Composite Data Table. . . . . . . . . . . . . . . . . . . . . . . . . 5 Diamond. . . . . . . . •. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bibliography . . . . . . •. . . . . . . . . . . . . . . . . . . . . . . 11 Germanium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Bibliography . . . . . . . . •. . . . . . . . . . . . . . . . . . . . . 28 Silicon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Author: Rainer Waser
Publisher: John Wiley & Sons
Published: 2012-05-29
Total Pages: 1041
ISBN-13: 3527409270
DOWNLOAD EBOOK →Fachlich auf höchstem Niveau, visuell überzeugend und durchgängig farbig illustriert: Das ist die neue Auflage der praxisbewährten Einführung in spezialisierte elektronische Materialien und Bauelemente aus der Informationstechnologie. Über ein Drittel des Inhalts ist neu, alle anderen Beiträge wurden gründlich überarbeitet und aktualisiert.
Author: Charles Harper
Publisher: McGraw-Hill
Published: 2003-08
Total Pages: 764
ISBN-13: 9780071634014
DOWNLOAD EBOOK →Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."
Author: Susan C. Lockerby
Publisher:
Published: 1989
Total Pages: 1317
ISBN-13: 9780938994503
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