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Author: Materials Research Society. Meeting
Publisher:
Published: 2004-09
Total Pages: 318
ISBN-13:
DOWNLOAD EBOOK →The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Author: Duane S. Boning
Publisher: Cambridge University Press
Published: 2014-06-05
Total Pages: 310
ISBN-13: 9781107409194
DOWNLOAD EBOOK →While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.
Author: A. Kumar
Publisher:
Published: 2005-07-19
Total Pages: 330
ISBN-13:
DOWNLOAD EBOOK →Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Author: Materials Research Society. Meeting
Publisher:
Published: 2004-07-27
Total Pages: 304
ISBN-13:
DOWNLOAD EBOOK →The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Materials Research Society. Meeting
Publisher:
Published: 2004-08-18
Total Pages: 328
ISBN-13:
DOWNLOAD EBOOK →The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, brings together researchers interested in strained SiGe, strain-relaxed buffers, strained Si on bulk Si and on SOI, SiGe on SOI, Ge substrates, and Ge on insulator.
Author: Materials Research Society. Meeting
Publisher:
Published: 2001-12-14
Total Pages: 312
ISBN-13:
DOWNLOAD EBOOK →The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
Author: S. V. Babu
Publisher:
Published: 2000-02-10
Total Pages: 304
ISBN-13:
DOWNLOAD EBOOK →The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: R. J. Carter
Publisher:
Published: 2004-09
Total Pages: 432
ISBN-13:
DOWNLOAD EBOOK →The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
