Advanced Metallization Conference 2008 (AMC 2008):

Advanced Metallization Conference 2008 (AMC 2008): PDF

Author: Mehul Naik

Publisher: Materials Research Society

Published: 2009-01-01

Total Pages: 769

ISBN-13: 9781605111254

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The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

Advanced Metallization Conference 2007 (AMC 2007): Volume 23

Advanced Metallization Conference 2007 (AMC 2007): Volume 23 PDF

Author: Andrew J. McKerrow

Publisher: Materials Research Society

Published: 2008-01-01

Total Pages: 0

ISBN-13: 9781558999923

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The Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.

Advanced Metallization Conference 2003 (AMC 2003):

Advanced Metallization Conference 2003 (AMC 2003): PDF

Author: Gary W. Ray

Publisher: Materials Research Society

Published: 2004-01-01

Total Pages: 792

ISBN-13: 9781558997578

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The Advanced Metallization Conference (AMC) marked its twentieth anniversary in 2003. Technical leaders from around the world gather to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, vertical integration, advanced packaging and optical interconnects. In particular, presentations highlight both the advances and future challenges associated with multilevel interconnect. The latest developments in the integration of copper-based metallization with low-dielectric constant materials, and advances in the understanding of copper morphology and the reliability of the component materials of interconnect systems, are featured. Additional contributions discuss the development of advanced materials and advanced process technologies. Optimization of interconnect performance and density, and alternatives to metal-based interconnect, are addressed in papers on interconnect performance issues, vertical integration and system-in-a-package versus system-on-a-chip.

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